IC chip stress during plastic package molding SAND980383C DE98 002897 CONF980550

IC chip stress during plastic package molding

SAND980383C DE98 002897 CONF980550

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Material Type: 規格・テクニカルリポート類
Title: IC chip stress during plastic package molding
Author/Editor: Palmer, D. W
Benson, D. A
Peterson, D. W
Sweet, J. N
Publication Date: 1998
Publication Date (W3CDTF): 1998
Extent: 8 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : SAND980383C
テクニカルリポート番号 : DE98 002897
テクニカルリポート番号 : CONF980550
Holding library: 国立国会図書館
Call No.: LS-DE98/002897
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005909247
http://id.ndl.go.jp/bib/000005909247
Bibliographic Record Category (NDL): 291