Thermal strain measurement of the solder joints in BGA packages by using electron moire method ASME-99-IMECE/EEP-30

Thermal strain measurement of the solder joints in BGA packages by using electron moire method

ASME-99-IMECE/EEP-30

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Material Type: 規格・テクニカルリポート類
Title: Thermal strain measurement of the solder joints in BGA packages by using electron moire method
Author/Editor: Xie, Huimin
Kishimoto, Satoshi
Liu, Sheng
Zou, Daqing
Publication Date: 1999
Publication Date (W3CDTF): 1999
Extent: 6 p
Alternative Title: ASME international mechanical engineering congress & exposition. Nashville, Tenn. Nov. 1999
Report No.: テクニカルリポート番号 : ASME-99-IMECE/EEP-30
Holding library: 国立国会図書館
Call No.: M-ASME-99-IMECE/EEP-30
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000006069011
http://id.ndl.go.jp/bib/000006069011
Bibliographic Record Category (NDL): 291