Thermal math modeling and analysis of electronic package components AIAA-2000-2578

Thermal math modeling and analysis of electronic package components

AIAA-2000-2578

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Material Type: 規格・テクニカルリポート類
Title: Thermal math modeling and analysis of electronic package components
Author/Editor: Shukla, K. N
Publication Date: 2000
Publication Date (W3CDTF): 2000
Extent: 10 p
Alternative Title: AIAA thermophysics conference. 34th. Denver, Colo. Jun. 2000
Report No.: テクニカルリポート番号 : AIAA-2000-2578
Holding library: 国立国会図書館
Call No.: M-AIAA-2000-2578
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000006084970
http://id.ndl.go.jp/bib/000006084970
Bibliographic Record Category (NDL): 291