Recent advances on a wafer-level flip chip packaging process SME-FC01-138

Recent advances on a wafer-level flip chip packaging process

SME-FC01-138

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Material Type: 規格・テクニカルリポート類
Title: Recent advances on a wafer-level flip chip packaging process
Author/Editor: Tong, Q. K
Ma, B
Zhang, E
Savoca, A
Nguyen, L
Quentin, C
Luo, S
Li, H
Fan, L
Wong, C. P
Publication Date: 2001
Publication Date (W3CDTF): 2001
Extent: 7 p
Report No.: テクニカルリポート番号 : SME-FC01-138
Holding library: 国立国会図書館
Call No.: M-SME-FC01-138
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000006097649
http://id.ndl.go.jp/bib/000006097649
Bibliographic Record Category (NDL): 291