Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology -- 2003 : presented at the 2003 ASME international mechanical engineering congress : November 15-21, 2003 : Washington, D.C. : Nov 2003, Washington, DC.

• Material Type: 図書
• ISBN: 0791837149
• Title: Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology -- 2003 : presented at the 2003 ASME international mechanical engineering congress : November 15-21, 2003 : Washington, D.C. : Nov 2003, Washington, DC.
• Series Title: EPP ; 3
• Title Heading: EPP (Series) ; v. 3.
• Author Heading: Lee, R. (Ricky); International Mechanical Engineering Congress and Exposition (2003 : Washington, D.C.)
• Publication, Distribution, etc.: New York : American Society of Mechanical Engineers
• Publication Date: c2003.
• Publication Date (W3CDTF): 2003
• Extent: xi, 893 p. : ill. ; 28 cm.
• Place of Publication (Country Code): US
• Text Language Code: eng
• Subject Heading: Electronic packaging -- Congresses.; Photonics -- Congresses.; Nanotechnology -- Congresses.; Microelectronic packaging -- Congresses.; Surface mount technology -- Congresses.; Microelectromechanical systems -- Congresses.; Integrated circuits -- Wafer-scale integration -- Congresses.
• NDLC: M17
• Note (General): Papers.
• Note (Bibliography): Includes bibliographical references and author index.
• Holding library: 国立国会図書館
• Call No.: M17-04-2205
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 000007332322; http://id.ndl.go.jp/bib/000007332322
• RLIN No.: NYCXV5011488-B
• Bibliographic Record Category (NDL): 215