Materials, integration and packaging issues for high-frequency devices : symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A. : symposium B, the 1st MRS symposium on "materials, integration and packaging issues for high-frequency devices" : 2003 MRS fall meeting : Dec 2003, Boston, MA. (Materials Research Society Symposia Proceedings ; 783)

Materials, integration and packaging issues for high-frequency devices : symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A. : symposium B, the 1st MRS symposium on "materials, integration and packaging issues for high-frequency devices" : 2003 MRS fall meeting : Dec 2003, Boston, MA.

(Materials Research Society Symposia Proceedings ; 783)

Call No. (NDL): M17-04-2661
Bibliographic ID of National Diet Library: 000007402958

Material type: 図書

Author: Muralt, P.ほか

Publisher: Materials Research Society

Publication date: c2004.

Material Format: Paper

Capacity, size, etc.: xiii, 232 p. : ill. ; 24 cm.

NDC: -

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Note (General)：: Papers."This volume is a collection of half of the papers given at Symposium B, the first MRS symposium on 'Materials, Integration and Packaging Issue...

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Paper

Material Type: 図書
ISBN: 1558997210
Title: Materials, integration and packaging issues for high-frequency devices : symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A. : symposium B, the 1st MRS symposium on "materials, integration and packaging issues for high-frequency devices" : 2003 MRS fall meeting : Dec 2003, Boston, MA.
Series Title: Materials Research Society Symposia Proceedings ; 783
Title Heading: Materials Research Society symposia proceedings ; v. 783.
Author Heading: Muralt, P.
Materials Research Society. Meeting (2003 : Boston, Mass.)
Symposium on Materials, Integration and Packaging Issues for High-Frequency Devices (2003 : Boston, Mass.)
Publication, Distribution, etc.: Warrendale : Materials Research Society
Publication Date: c2004.
Publication Date (W3CDTF): 2004
Extent: xiii, 232 p. : ill. ; 24 cm.
Place of Publication (Country Code): US
Text Language Code: eng
Subject Heading: Electronic packaging -- Materials -- Congresses.
LCC: TK7870.15
NDLC: M17
Note (General): Papers.
"This volume is a collection of half of the papers given at Symposium B, the first MRS symposium on 'Materials, Integration and Packaging Issues for High-Frequency devices, ' held December 1-3 at the 2003 MRS Fall Meeting in Boston, Massachusetts." -- p. xi.
Note (Bibliography): Includes bibliographical references and indexes.
Holding library: 国立国会図書館
Call No.: M17-04-2661
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000007402958
http://id.ndl.go.jp/bib/000007402958
RLIN No.: CTYA6600383-B
Bibliographic Record Category (NDL): 215