Thermal conductivity 26 : thermal expansion 14 : joint conferences : August 6-8, 2001 Cambridge, Massachusetts, USA. : ITCC/ITES conference : Aug 2001, Cambridge, MA.

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Material Type: 図書
ISBN: 1932078363
Title: Thermal conductivity 26 : thermal expansion 14 : joint conferences : August 6-8, 2001 Cambridge, Massachusetts, USA. : ITCC/ITES conference : Aug 2001, Cambridge, MA.
Author Heading: Holometrix Micromet.
Publication, Distribution, etc.: Lancaster : DEStech Publications
Publication Date: c2005.
Publication Date (W3CDTF): 2005
Extent: x, 581 p. : ill. ; 24 cm.
Alternative Title: Proceedings of the twenty-sixth international thermal conductivity conference : proceedings of the fourteenth international thermal expansion symposium
Place of Publication (Country Code): US
NDLC: M17
Note (General): Papers.
Note (Bibliography): Includes bibliographical references and indexes.
Holding library: 国立国会図書館
Call No.: M17-05-130
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000007596539
http://id.ndl.go.jp/bib/000007596539
Bibliographic Record Category (NDL): 215