図書

SEMI technical programs present SEMICON China 2004 SEMI packaging course : March 16, 2004 : SEMICON China 2004 : RiverFront Business Hotel : Shanghai, China. : Mar 2004, Shanghai, China.

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SEMI technical programs present SEMICON China 2004 SEMI packaging course : March 16, 2004 : SEMICON China 2004 : RiverFront Business Hotel : Shanghai, China. : Mar 2004, Shanghai, China.

Call No. (NDL)
M17-05-1056
Bibliographic ID of National Diet Library
000007733808
Material type
図書
Author
Semiconductor Equipment and Materials International (SEMI)
Publisher
SEMI
Publication date
c2004.
Material Format
Paper
Capacity, size, etc.
146 p. : ill. ; 30 cm.
NDC
-
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Presentations.

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Paper

Material Type
図書
Title
SEMI technical programs present SEMICON China 2004 SEMI packaging course : March 16, 2004 : SEMICON China 2004 : RiverFront Business Hotel : Shanghai, China. : Mar 2004, Shanghai, China.
Author Heading
Semiconductor Equipment and Materials International (SEMI)
Publication, Distribution, etc.
SEMI
Publication Date
c2004.
Publication Date (W3CDTF)
2004
Extent
146 p. : ill. ; 30 cm.
Alternative Title
SEMICON China2004 : SEMI packaging course : flip chip and WLCSP technologies for low cost high density packaging and PCB assemblies : programs for the semiconductor, flat panel display, MEMS and related microelectronics industries
NDLC
M17
Note (General)
Presentations.