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Bibliographic Record
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- Material Type
- 図書
- Publication, Distribution, etc.
- Publication Date
- c2004.
- Publication Date (W3CDTF)
- 2004
- Extent
- 146 p. : ill. ; 30 cm.
- Alternative Title
- SEMICON China2004 : SEMI packaging course : flip chip and WLCSP technologies for low cost high density packaging and PCB assemblies : programs for the semiconductor, flat panel display, MEMS and related microelectronics industries
- NDLC
- Note (General)
- Presentations.