半導体集積回路プロセス用研磨剤の開発

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Material Type: 博士論文
Title: 半導体集積回路プロセス用研磨剤の開発
Title Transcription: ハンドウタイシュウセキカイロプロセスヨウケンマザイノカイハツ
Author/Editor: 羽場真一 [著]
Author Heading: 羽場, 真一ハバ, シンイチ
Publication, Distribution, etc.: [羽場真一]
Publication Date: [2004]
Publication Date (W3CDTF): 2004
Extent: 1冊
Alternative Title: Development of polishing slurry for semiconductor integrated circuit fabrication process
Degree grantor/type: 高知工科大学
Date Granted: 平成16年3月22日
Date Granted (W3CDTF): 2004
Dissertation Number: 甲第30号
Degree Type: 博士 (工学)
Note (Dissertation): 博士論文
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: UT51
Note (General): 博士論文
Holding library: 国立国会図書館
Call No.: UT51-2005-B461
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000007769297
http://id.ndl.go.jp/bib/000007769297
Bibliographic Record Category (NDL): 213