Proceeding of the seventh IEEE CPMT conference on high density microsystem design, packaging and failure analysis (HDP'05) : June 27-June 30, 2005 : Shanghai University, Shanghai, China. : 7th international IEEE CPMT conference on high density microsystem design, packaging and component failure analysis in electronics manufacturing : Jun 2005, Shanghai, China.

• Material Type: 図書
• ISBN: 0780392922 (softbound edition); 0780392930 (CD-ROM edition)
• Title: Proceeding of the seventh IEEE CPMT conference on high density microsystem design, packaging and failure analysis (HDP'05) : June 27-June 30, 2005 : Shanghai University, Shanghai, China. : 7th international IEEE CPMT conference on high density microsystem design, packaging and component failure analysis in electronics manufacturing : Jun 2005, Shanghai, China.
• Author Heading: Institute of Electrical and Electronics Engineers.
• Publication, Distribution, etc.: Piscataway : IEEE
• Publication Date: c2005.
• Publication Date (W3CDTF): 2005
• Extent: 549 p. : ill. ; 29 cm.
• Alternative Title: Proceeding of the 7th IEEE CPMT conference on high density microsystem design, packaging and failure analysis (HDP'05) : June 27-June 30, 2005 : Shanghai University, Shanghai, China; Proceedings : (HDP'05) : the seventh IEEE CPMT conference on high density microsystem design, packaging and failure analysis
• Place of Publication (Country Code): US
• NDLC: M17
• Note (General): Papers and abstracts.; IEEE cat no 05EX1122 (softbound edition) , 05EX1122C (CD-ROM edition) .
• Note (Bibliography): Includes bibliographical references and author index.
• Holding library: 国立国会図書館
• Call No.: M17-06-274
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 000008034940; http://id.ndl.go.jp/bib/000008034940
• Bibliographic Record Category (NDL): 215