Sequential activation process for wafer direct bonding at room temperature

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Material Type: 博士論文
Title: Sequential activation process for wafer direct bonding at room temperature
Author/Editor: Tae Hyun Kim [著]
Author Heading: 金, 泰賢キム, テホン
Publication, Distribution, etc.: [Tae Hyun Kim]
Publication Date: 2004
Publication Date (W3CDTF): 2004
Extent: 1冊
Alternative Title: 常温ウエハ直接接合のためのシーケンシャル活性化プロセスジョウオンウエハチョクセツセツゴウノタメノシーケンシャルカッセイカプロセス
Degree grantor/type: 東京大学
Date Granted: 平成16年4月15日
Date Granted (W3CDTF): 2004
Dissertation Number: 甲第19552号
Degree Type: 博士 (工学)
Note (Dissertation): 博士論文
Place of Publication (Country Code): JP
Text Language Code: eng
Alias of Author: Kim, Tae Hyun
NDLC: UT51
Note (General): 博士論文
Holding library: 国立国会図書館
Call No.: UT51-2006-C769
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000008163172
http://id.ndl.go.jp/bib/000008163172
Bibliographic Record Category (NDL): 213