A study on the chemical vapor deposition of TiN based Cu diffusion barriers for ULSI multilevel interconnect technology

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Material Type: 博士論文
Title: A study on the chemical vapor deposition of TiN based Cu diffusion barriers for ULSI multilevel interconnect technology
Author/Editor: 申栄訓 [著]
Author Heading: 申, 榮訓シン, ヨンフン
Publication, Distribution, etc.: [申栄訓]
Publication Date: [2005]
Publication Date (W3CDTF): 2005
Extent: 1冊
Alternative Title: ULSI多層配線用TiN系Cu拡散バリヤ膜のCVD合成に関する研究 ULSI タソウハイセンヨウ TiNケイ Cu カクサンバリヤマクノ CVD ゴウセイニカンスルケンキュウ
Degree grantor/type: 東京大学
Date Granted: 平成17年3月24日
Date Granted (W3CDTF): 2005
Dissertation Number: 甲第20104号
Degree Type: 博士 (工学)
Note (Dissertation): 博士論文
Place of Publication (Country Code): JP
Text Language Code: eng
Alias of Author: Shin, Young-Hoon
NDLC: UT51
Note (General): 博士論文
Holding library: 国立国会図書館
Call No.: UT51-2006-D339
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000008171045
http://id.ndl.go.jp/bib/000008171045
Bibliographic Record Category (NDL): 213