Thirty-second IEEE international electronics manufacturing technology symposium and twelfth IEEE international symposium on advanced packaging materials : October 3-5, 2007 : Holiday Inn San Jose : San Jose/Silicon Valley, CA USA. : 2007 combined IEMT and APM symposium : joint IEMT-APM : joint IEMT/APM : Oct 2007, San Jose, CA.

Thirty-second IEEE international electronics manufacturing technology symposium and twelfth IEEE international symposium on advanced packaging materials : October 3-5, 2007 : Holiday Inn San Jose : San Jose/Silicon Valley, CA USA. : 2007 combined IEMT and APM symposium : joint IEMT-APM : joint IEMT/APM : Oct 2007, San Jose, CA.

Call No. (NDL): M17-08-750
Bibliographic ID of National Diet Library: 000009285770

Material type: 図書

Author: IEEE. Components, Packaging, and Manufacturing Technology Society.ほか

Publisher: IEEE

Publication date: c2007.

Material Format: Paper

Capacity, size, etc.: x, 348 p. : ill. ; 28 cm.

NDC: -

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Note (General)：: Papers and abstracts.IEEE cat no 07CH37917, 07CH37917C (CD-ROM ed.) .

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Paper

Material Type: 図書
ISBN: 1424413354
1424413362 (CD-ROM ed.)
ISSN: 1089-8190
Title: Thirty-second IEEE international electronics manufacturing technology symposium and twelfth IEEE international symposium on advanced packaging materials : October 3-5, 2007 : Holiday Inn San Jose : San Jose/Silicon Valley, CA USA. : 2007 combined IEMT and APM symposium : joint IEMT-APM : joint IEMT/APM : Oct 2007, San Jose, CA.
Author Heading: IEEE. Components, Packaging, and Manufacturing Technology Society.
IEEE CPMT Santa Clara Valley Chapter.
Publication, Distribution, etc.: Piscataway : IEEE
Publication Date: c2007.
Publication Date (W3CDTF): 2007
Extent: x, 348 p. : ill. ; 28 cm.
Alternative Title: 32nd IEEE international electronics manufacturing technology symposium and 12th IEEE international symposium on advanced packaging materials : October 3-5, 2007 : Holiday Inn San Jose : San Jose/Silicon Valley, CA USA
Thirty-second IEEE international electronics manufacturing technology symposium : collocated with the twelfth IEEE international symposium on advanced packaging materials : processes, properties and interfaces : proceedings 2007 : San Jose, CA USA : October 3-5, 2007
Proceedings 2007 : 32nd IEEE int'l electronics manufacturing technology symposium and the 12th IEEE advanced packaging materials symposium
Place of Publication (Country Code): US
NDLC: M17
Note (General): Papers and abstracts.
IEEE cat no 07CH37917, 07CH37917C (CD-ROM ed.) .
Note (Bibliography): Includes bibliographical references.
Holding library: 国立国会図書館
Call No.: M17-08-750
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000009285770
http://id.ndl.go.jp/bib/000009285770
Bibliographic Record Category (NDL): 215