Joining properties and joint reliability of Si die-attached joint with Zn-Sn based high temperature lead-free solder

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Material Type: 博士論文
Title: Joining properties and joint reliability of Si die-attached joint with Zn-Sn based high temperature lead-free solder
Author/Editor: Seongjun Kim [著]
Author Heading: 金, 声俊キム, ソンジュン
Publication, Distribution, etc.: [Seongjun Kim]
Publication Date: [2009]
Publication Date (W3CDTF): 2009
Extent: 1冊
Alternative Title: Zn-Sn系高温用鉛フリーはんだのダイアタッチ接合特性及び接合部信頼性 Zn - Snケイコウオンヨウナマリフリーハンダノダイアタッチセツゴウトクセイオヨビセツゴウブシンライセイ
Degree grantor/type: 大阪大学
Date Granted: 平成21年3月24日
Date Granted (W3CDTF): 2009
Dissertation Number: 甲第13418号
Degree Type: 博士 (工学)
Note (Dissertation): 博士論文
Place of Publication (Country Code): JP
Text Language Code: eng
Alias of Author: Kim, Seongjun
NDLC: UT51
Note (General): 博士論文
Holding library: 国立国会図書館
Call No.: UT51-2009-C356
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000010260925
http://id.ndl.go.jp/bib/000010260925
Bibliographic Record Category (NDL): 213