高密度回路基板への無電解銅めっきの応用

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Material Type: 博士論文
Title: 高密度回路基板への無電解銅めっきの応用
Title Transcription: コウミツドカイロキバンエノムデンカイドウメッキノオウヨウ
Author/Editor: 井上浩徳 [著]
Author Heading: 井上, 浩徳イノウエ, コウトク
Publication, Distribution, etc.: [井上浩徳]
Publication Date: [2009]
Publication Date (W3CDTF): 2009
Extent: 1冊
Alternative Title: Electroless copper plating for application of high density printed circuit board
Degree grantor/type: 関東学院大学
Date Granted: 平成21年3月24日
Date Granted (W3CDTF): 2009
Dissertation Number: 甲第97号
Degree Type: 博士 (工学)
Note (Dissertation): 博士論文
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: UT51
Note (General): 博士論文
Holding library: 国立国会図書館
Call No.: UT51-2009-E946
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000010392415
http://id.ndl.go.jp/bib/000010392415
Bibliographic Record Category (NDL): 213