ULSI多層配線用Cuめっきプロセス技術の研究

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Material Type: 博士論文
Title: ULSI多層配線用Cuめっきプロセス技術の研究
Title Transcription: ULSI タソウハイセンヨウ Cu メッキプロセスギジュツノケンキュウ
Author/Editor: 下山正 [著]
Author Heading: 下山, 正シモヤマ, マサシ
Publication, Distribution, etc.: [下山正]
Publication Date: [2008]
Publication Date (W3CDTF): 2008
Extent: 1冊
Alternative Title: Plating processes for copper interconnect fabrications on ULSI device
Degree grantor/type: 広島大学
Date Granted: 平成20年3月23日
Date Granted (W3CDTF): 2008
Dissertation Number: 甲第4561号
Degree Type: 博士 (工学)
Note (Dissertation): 博士論文
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: UT51
Note (General): 博士論文
Holding library: 国立国会図書館
Call No.: UT51-2009-G163
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000010482915
http://id.ndl.go.jp/bib/000010482915
Bibliographic Record Category (NDL): 213