Packaging, chip-package interactions and solder materials challenges : April 13-17, 2009 : San, [sic] Francisco, California, USA. : Apr 2009, San Francisco, CA. (Materials Research Society Symposia Proceedings ; 1158)

Packaging, chip-package interactions and solder materials challenges : April 13-17, 2009 : San, [sic] Francisco, California, USA. : Apr 2009, San Francisco, CA.

(Materials Research Society Symposia Proceedings ; 1158)

Call No. (NDL): M17-10-2183
Bibliographic ID of National Diet Library: 000010705737

Material type: 図書

Author: Materials Research Society. Meeting (2009 : San Francisco, Calif.)

Publisher: Materials Research Society

Publication date: c2009.

Material Format: Paper

Capacity, size, etc.: 84 p. : ill. ; 24 cm.

NDC: -

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Notes on use

Note (General)：: Papers."Spring 2009" -- cover.

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Paper

Material Type: 図書
ISBN: 9781615677788
Title: Packaging, chip-package interactions and solder materials challenges : April 13-17, 2009 : San, [sic] Francisco, California, USA. : Apr 2009, San Francisco, CA.
Series Title: Materials Research Society Symposia Proceedings ; 1158
Title Heading: Materials Research Society symposia proceedings ; v. 1158.
Author Heading: Materials Research Society. Meeting (2009 : San Francisco, Calif.)
Publication, Distribution, etc.: Warrendale : Materials Research Society
Publication Date: c2009.
Publication Date (W3CDTF): 2009
Extent: 84 p. : ill. ; 24 cm.
Place of Publication (Country Code): US
Text Language Code: eng
Subject Heading: Chip scale packaging -- Materials -- Congresses.
Solder and soldering -- Congresses.
NDLC: M17
Note (General): Papers.
"Spring 2009" -- cover.
Note (Bibliography): Includes bibliographical references and author index.
Holding library: 国立国会図書館
Call No.: M17-10-2183
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000010705737
http://id.ndl.go.jp/bib/000010705737
OCLC No.: 503828560
https://www.worldcat.org/oclc/503828560
Bibliographic Record Category (NDL): 215