3rd international conference on tangible and embedded interaction 2009 : (TEI'09) : Cambridge, United Kingdom : 16-18 February 2009. : TEI 2009 : Feb 2009, Cambridge, UK.

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Material Type: 図書
ISBN: 9781615679645
Title: 3rd international conference on tangible and embedded interaction 2009 : (TEI'09) : Cambridge, United Kingdom : 16-18 February 2009. : TEI 2009 : Feb 2009, Cambridge, UK.
Author Heading: Villar, Nicolas.
Izadi, Shahram.
Fraser, Mike.
Benford, Steve.
International Conference on Tangible and Embedded Interaction (3rd : 2009 : Cambridge, England)
Publication, Distribution, etc.: New York : Association for Computing Machinery
Publication Date: c2009.
Publication Date (W3CDTF): 2009
Extent: xix, 400 p. : ill. ; 28 cm.
Place of Publication (Country Code): US
Text Language Code: eng
Subject Heading: Computer networks -- Congresses.
High performance computing -- Congresses.
NDLC: M17
Note (General): Abstracts and papers.
Note (Bibliography): Includes bibliographical references.
Holding library: 国立国会図書館
Call No.: M17-10-2741
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000010893536
http://id.ndl.go.jp/bib/000010893536
OCLC No.: 495441603
https://www.worldcat.org/oclc/495441603
Bibliographic Record Category (NDL): 215