2009 IEEE electrical design of advanced packaging & systems symposium : (EDAPS 2009) : Hong Kong : 2-4 December 2009. : Dec 2009, Hong Kong, China.

Author: Electrical Design of Advanced Packaging and Systems Symposium (2009 : Shatin, Hong Kong, China)

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Material Type: 図書
ISBN: 9781424453504
Title: 2009 IEEE electrical design of advanced packaging & systems symposium : (EDAPS 2009) : Hong Kong : 2-4 December 2009. : Dec 2009, Hong Kong, China.
Author Heading: Electrical Design of Advanced Packaging and Systems Symposium (2009 : Shatin, Hong Kong, China)
Publication, Distribution, etc.: Piscataway : IEEE
Publication Date: c2009.
Publication Date (W3CDTF): 2009
Extent: 185 p. : ill. ; 28 cm.
Alternative Title: 2009 IEEE electrical design of advanced packaging and systems symposium : (EDAPS 2009) : Hong Kong : 2-4 December 2009
Place of Publication (Country Code): US
Text Language Code: eng
Subject Heading: Electronic packaging -- Congresses.
Microelectronic packaging -- Congresses.
LCC: TK7874
NDLC: M17
Note (General): Papers.
IEEE cat no CFP09EDP-PRT.
Note (Bibliography): Includes bibliographical references and author index.
Holding library: 国立国会図書館
Call No.: M17-10-3085
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000010900748
http://id.ndl.go.jp/bib/000010900748
OCLC No.: 613538602
https://www.worldcat.org/oclc/613538602
Bibliographic Record Category (NDL): 215