2009 4th international microsystems, packaging, assembly and circuits technology conference : (IMPACT 2009) : Taipei, Taiwan : 21-23 October 2009. : IMPACT2009 : international 3D IC workshop : international microsystems, packaging, assembly and circuit conference : Oct 2009, Taipei, Taiwan.

• Material Type: 図書
• ISBN: 9781424443413
• Title: 2009 4th international microsystems, packaging, assembly and circuits technology conference : (IMPACT 2009) : Taipei, Taiwan : 21-23 October 2009. : IMPACT2009 : international 3D IC workshop : international microsystems, packaging, assembly and circuit conference : Oct 2009, Taipei, Taiwan.
• Author Heading: Components, Packaging & Manufacturing Technology Society. Taipei Chapter.; International Microsystems, Packaging, Assembly, and Circuits Technology Conference (4th : 2009 : Taipei, Taiwan)
• Publication, Distribution, etc.: Piscataway : IEEE
• Publication Date: c2009.
• Publication Date (W3CDTF): 2009
• Extent: 656 p. : ill. (some col.) ; 28 cm.
• Place of Publication (Country Code): US
• Text Language Code: eng
• Subject Heading: Microelectromechanical systems -- Congresses.; Microelectronic packaging -- Congresses.
• LCC: TK7870.15
• NDLC: M17
• Note (General): Program and papers.; "This annual conference has already established (...) " -- welcome message from K.N. Chiang, conference co-chair.; " (...) I would like to invite you to visit TPCA Show 2009 (...) in conjunction with IMPACT." -- welcome message from Simon Chen, conference co-chair.; IEEE cat no CFP0959B-PRT.
• Note (Bibliography): Includes bibliographic references.
• Holding library: 国立国会図書館
• Call No.: M17-10-4026
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 000010964689; http://id.ndl.go.jp/bib/000010964689
• OCLC No.: 613541738; https://www.worldcat.org/oclc/613541738
• Bibliographic Record Category (NDL): 215