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博士論文

半導体パッケージ用封止材料の開発と応用

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半導体パッケージ用封止材料の開発と応用

Call No. (NDL)
UT51-2010-K310
Bibliographic ID of National Diet Library
000011035517
Material type
博士論文
Author
宝藏寺裕之 [著]
Publisher
[宝藏寺裕之]
Publication date
[2010]
Material Format
Paper
Capacity, size, etc.
1冊
Name of awarding university/degree
横浜国立大学,博士 (工学)
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Paper

Material Type
博士論文
Title Transcription
ハンドウタイ パッケージヨウ フウシ ザイリョウ ノ カイハツ ト オウヨウ
Author/Editor
宝藏寺裕之 [著]
Author Heading
宝蔵寺, 裕之 ホウゾウジ, ヒロユキ
Publication, Distribution, etc.
Publication Date
[2010]
Publication Date (W3CDTF)
2010
Extent
1冊
Alternative Title
Development and application of molding compounds for semiconductor package