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Bibliographic Record
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- Material Type
- 博士論文
- Title
- Title Transcription
- ハンドウタイ パッケージヨウ フウシ ザイリョウ ノ カイハツ ト オウヨウ
- Author/Editor
- 宝藏寺裕之 [著]
- Author Heading
- 宝蔵寺, 裕之 ホウゾウジ, ヒロユキ
- Publication, Distribution, etc.
- Publication Date
- [2010]
- Publication Date (W3CDTF)
- 2010
- Extent
- 1冊
- Alternative Title
- Development and application of molding compounds for semiconductor package