Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices 10 : 24-25 January 2011 : San Francisco, California, United States. : reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices conference : photonics west 2011's MOEMS-MEMS symposium : Jan 2011, San Francisco, CA. (SPIE Proceedings ; 7928)

Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices 10 : 24-25 January 2011 : San Francisco, California, United States. : reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices conference : photonics west 2011's MOEMS-MEMS symposium : Jan 2011, San Francisco, CA.

(SPIE Proceedings ; 7928)

Call No. (NDL): M17-11-2358
Bibliographic ID of National Diet Library: 000011203053

Material type: 図書

Author: Garcia-Blanco, Sonia. Universiteit Twente (Netherlands)ほか

Publisher: SPIE

Publication date: c2011.

Material Format: Paper

Capacity, size, etc.: 1 v. (various pagings) : ill. ; 28 cm.

NDC: -

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Notes on use

Note (General)：: Papers."This conference (...) has been held for over 10 consecutive years." -- introd.

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Paper

Material Type: 図書
ISBN: 9780819484659
ISSN (series): 0277-786X
Title: Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices 10 : 24-25 January 2011 : San Francisco, California, United States. : reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices conference : photonics west 2011's MOEMS-MEMS symposium : Jan 2011, San Francisco, CA.
Series Title: SPIE Proceedings ; 7928
Title Heading: SPIE digital library.
Proceedings of SPIE -- the International Society for Optical Engineering, 0277-786X ; v. 7928.
Author Heading: Garcia-Blanco, Sonia. Universiteit Twente (Netherlands)
Ramesham, Rajeshuni.
Publication, Distribution, etc.: Bellingham : SPIE
Publication Date: c2011.
Publication Date (W3CDTF): 2011
Extent: 1 v. (various pagings) : ill. ; 28 cm.
Alternative Title: SPIE photonics west
Place of Publication (Country Code): US
Text Language Code: eng
Subject Heading: Microelectromechanical systems -- Reliability -- Congresses.
Microelectromechanical systems -- Testing -- Congresses.
Microelectronic packaging -- Congresses.
Electronic books.
LCC: TK7875
NDLC: M17
Note (General): Papers.
"This conference (...) has been held for over 10 consecutive years." -- introd.
Note (Bibliography): Includes bibliographical references and author index.
Holding library: 国立国会図書館
Call No.: M17-11-2358
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000011203053
http://id.ndl.go.jp/bib/000011203053
OCLC No.: 721907295
https://www.worldcat.org/oclc/721907295
Bibliographic Record Category (NDL): 215