2008 international conference on electronic packaging technology & high density packaging : Shanghai, China : 28-31 July 2008. : Jul 2008, Shanghai, China.

• Material Type: 図書
• ISBN (set): 9781424427390 (set)
• Title: 2008 international conference on electronic packaging technology & high density packaging : Shanghai, China : 28-31 July 2008. : Jul 2008, Shanghai, China.
• Author Heading: China Electronic Packaging Society.; Bi, Keyun.; Xiao, Fei.; International Conference on Electronic Packaging Technology & High Density Packaging (2008 : Shanghai, China)
• Publication, Distribution, etc.: Piscataway : IEEE
• Publication Date: c2008.
• Publication Date (W3CDTF): 2008
• Extent: 2 v. : ill. ; 27 cm.
• Alternative Title: 2008 international conference on electronic packaging technology and high density packaging : Shanghai, China : 28-31 July 2008
• Place of Publication (Country Code): US
• Text Language Code: eng
• Subject Heading: Electronic packaging -- Congresses.
• NDLC: M17
• Note (General): Papers.; IEEE cat no CFP08553-PRT.
• Note (Bibliography): Includes bibliographical references and auuthor index.
• Holding library: 国立国会図書館
• Call No.: M17-11-3108
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 000011229526; http://id.ndl.go.jp/bib/000011229526
• OCLC No.: 320480676; https://www.worldcat.org/oclc/320480676
• Bibliographic Record Category (NDL): 215

• Contents: [Vol. 1]: Pages 1-550[Vol. 2]: Pages 551-1095.(Provided by: 国立国会図書館蔵書)