Proceedings of the ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS -- 2011 -- : presented at ASME 2011 Pacific Rim technical conference and exhigition [i.e. exhibition] on packaging and integration of electronic and photonic systems, MEMS and NEMS : July 6-8, 2011 : Portland, Oregon, USA : AME 2011 InterPACK conference : ASME/Pacific Rim technical conference and exhibition on integration and packaging of MEMS, NEMS, and electronic systems : ASME 2011 Pacific Rim technical conference & exposition on packaging and integration of electronic and photonic systems : InterPACK2011 : Jul 2011, Portland, OR.

• Material Type: 図書
• ISBN: 9780791844618 (pbk. : v. 1); 9780791844625 (pbk. : v. 2)
• Title: Proceedings of the ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS -- 2011 -- : presented at ASME 2011 Pacific Rim technical conference and exhigition [i.e. exhibition] on packaging and integration of electronic and photonic systems, MEMS and NEMS : July 6-8, 2011 : Portland, Oregon, USA : AME 2011 InterPACK conference : ASME/Pacific Rim technical conference and exhibition on integration and packaging of MEMS, NEMS, and electronic systems : ASME 2011 Pacific Rim technical conference & exposition on packaging and integration of electronic and photonic systems : InterPACK2011 : Jul 2011, Portland, OR.
• Author Heading: ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2011 : Portland, Or.); Suhling, J. C. (Jeffrey C.); Ishizuka, Masaru.; Tonapi, Sandeep Shrikant.
• Publication, Distribution, etc.: New York : ASME
• Publication Date: c2012.
• Publication Date (W3CDTF): 2012
• Extent: 2 v.
• Other physical details: ill.
• Size: 28 cm.
• Additional Title: 2011 proceedings of the ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS : IPACK2011.
• Place of Publication (Country Code): US
• Text Language Code: eng
• Subject Heading: Electronic packaging--Congresses.
• NDLC: M17
• Target Audience: 一般
• Note (General): Papers.; "It was renamed InterPACK in 1995, and has been occurring biannually since then." -- p. iii.; "On Friday, the conference will close with 15 outstanding tutorials (...)" -- p. iii.
• Note (Bibliography): Includes bibliographical references and author indexes.
• Holding library: 国立国会図書館
• Call No.: M17-12-3833
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 023768570; http://id.ndl.go.jp/bib/023768570
• LC Control Number: 2012471881; https://lccn.loc.gov/2012471881
• OCLC No.: 795707252; https://www.worldcat.org/oclc/795707252
• Cataloging Rule: Anglo-American Cataloging Rules
• Bibliographic Record Category (NDL): 215

• Contents: Vol. 1.Advanced packaging : (...) : emerging technologies.Vol. 2....