Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC

• Material Type: 図書
• ISBN: 9780470623466 (hardback); 0470623462 (hardback)
• Title: Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
• Author/Editor: Er-Ping Li.
• Author Heading: Li, Er-Ping.
• Publication, Distribution, etc.: Hoboken, N.J. : Wiley; Piscataway : IEEE Press
• Publication Date: c2012.
• Publication Date (W3CDTF): 2012
• Extent: xiv, 366 p.
• Other physical details: ill.
• Size: 25 cm.
• Place of Publication (Country Code): US
• Text Language Code: eng
• Subject Heading: Three-dimensional integrated circuits.; TECHNOLOGY & ENGINEERING / Electronics / Circuits / VLSI & ULSI.
• LCC: TK7874.893
• DDC: 621.3815
• Target Audience: 一般
• Note (Bibliography): Includes bibliographical references and index.
• Holding library: 国立国会図書館
• Call No.: ND386-B26
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 023851116; http://id.ndl.go.jp/bib/023851116
• LC Control Number: 2011028946; https://lccn.loc.gov/2011028946
• OCLC No.: 694396545; https://www.worldcat.org/oclc/694396545
• Bibliographic Record Category (NDL): 211

• Summary, etc.: "The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic M...