Semiconductor packaging : materials interaction and reliability

• Material Type: 図書
• ISBN: 9781439862056 (hardback : acid-free paper); 1439862052 (hardback : acid-free paper)
• Title: Semiconductor packaging : materials interaction and reliability
• Author/Editor: Andrea Chen, Randy Hsiao-Yu Lo.
• Author Heading: Chen, Andrea.; Lo, Randy.
• Publication, Distribution, etc.: Boca Raton, FL : CRC Press
• Publication Date: c2012.
• Publication Date (W3CDTF): 2012
• Extent: xviii, 198 p.
• Other physical details: ill.
• Size: 24 cm.
• Place of Publication (Country Code): US
• Text Language Code: eng
• Subject Heading: Microelectronic packaging.; TECHNOLOGY & ENGINEERING / Electronics / General.; TECHNOLOGY & ENGINEERING / Electronics / Circuits / General.; TECHNOLOGY & ENGINEERING / Material Science.
• LCC: TK7870.15
• DDC: 621.3815/2
• NDLC: ND351
• Target Audience: 一般
• Note (Bibliography): Includes bibliographical references and index.
• Holding library: 国立国会図書館
• Call No.: ND351-B49
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 023942915; http://id.ndl.go.jp/bib/023942915
• LC Control Number: 2011036199; https://lccn.loc.gov/2011036199
• OCLC No.: 751748040; https://www.worldcat.org/oclc/751748040
• Bibliographic Record Category (NDL): 211