Electroless copper and nickel-phosphorus plating : processing, characterisation and modelling (Woodhead Publishing in materials)

Electroless copper and nickel-phosphorus plating : processing, characterisation and modelling

(Woodhead Publishing in materials)

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Material Type: 図書
ISBN: 9781845698089
1845698088
Title: Electroless copper and nickel-phosphorus plating : processing, characterisation and modelling
Author/Editor: W. Sha, X. Wu and K.G. Keong.
Series Title: Woodhead Publishing in materials
Title Heading: Woodhead Publishing in materials.
Author Heading: Sha, Wei.
Wu, Xiaomin.
Keong, K. G. (Kim Ghee)
Publication, Distribution, etc.: Oxfrod : Woodhead Publishing Limited
Publication Date: 2011.
Publication Date (W3CDTF): 2011
Extent: xviii, 285 pages
Other physical details: illustrations
Size: 25 cm.
Place of Publication (Country Code): GB
Text Language Code: eng
Content Type: text
Media Type: unmediated
Carrier Type: volume
Subject Heading: Electroless plating.
Copper plating.
Nickel-plating.
Galvanostegie.
Stromloses Oberflächenbeschichten.
Stromloses Vernickeln.
LCC: TS662
NDLC: PD57
Target Audience: 一般
Note (Bibliography): Includes bibliographical references and index.
Holding library: 国立国会図書館
Call No.: PD57-B12
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 024059809
http://id.ndl.go.jp/bib/024059809
OCLC No.: 666239733
https://www.worldcat.org/oclc/666239733
Cataloging Rule: RDA
Bibliographic Record Category (NDL): 211