Lead free solder : mechanics and reliability

• Material Type: 図書
• ISBN: 9781461404620 (hbk. : alk. paper); 1461404622 (hbk. : alk. paper); 9781461404637 (e-ISBN))
• Title: Lead free solder : mechanics and reliability
• Author/Editor: John Hock Lye Pang.
• Author Heading: Pang, John Hock Lye.
• Publication, Distribution, etc.: New York, NY : Springer
• Publication Date: [2012]
• Publication Date (W3CDTF): 2012
• Extent: x, 175 pages
• Other physical details: illustrations
• Size: 24 cm
• Place of Publication (Country Code): US
• Text Language Code: eng
• Content Type: text
• Media Type: unmediated
• Carrier Type: volume
• Subject Heading: Solder and soldering.; Lead-free electronics manufacturing processes.; Green electronics.
• LCC: TS610
• DDC: 671.5/6
• NDLC: PD51
• Target Audience: 一般
• Note (Bibliography): Includes bibliographical references and index.
• Holding library: 国立国会図書館
• Call No.: PD51-B13
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 024387354; http://id.ndl.go.jp/bib/024387354
• LC Control Number: 2011937228; https://lccn.loc.gov/2011937228
• OCLC No.: 778459552; https://www.worldcat.org/oclc/778459552
• Cataloging Rule: RDA
• Bibliographic Record Category (NDL): 211