Thermal conductivity 31 : thermal expansion 19 : joint conferences : June 26-30, 2011 Saguenay, Québec, Canada : ITCC-ITES 2011 : ITCC : ITES : ITCC/ITES : Jun 2011, Saguenay, Canada.

Notes on use

Note (General)：: Papers."The conferences were held annually from 1961 to 1973 and biannually since 1973." -- p. xiii.

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Material Type: 図書
ISBN: 9781605950556
Title: Thermal conductivity 31 : thermal expansion 19 : joint conferences : June 26-30, 2011 Saguenay, Québec, Canada : ITCC-ITES 2011 : ITCC : ITES : ITCC/ITES : Jun 2011, Saguenay, Canada.
Author Heading: Université du Québec à Chicoutimi.
Publication, Distribution, etc.: Lancaster : DEStech Publications
Publication Date: c2013.
Publication Date (W3CDTF): 2013
Extent: xv, 326 p.
Other physical details: ill.
Size: 24 cm.
Additional Title: Thermal conductivity 31 : thermal expansion 19 : proceedings of the thirty-first international thermal conductivity conference : proceedings of the nineteenth international thermal expansion symposium.
Place of Publication (Country Code): US
Text Language Code: eng
NDLC: M17
Target Audience: 一般
Note (General): Papers.
"The conferences were held annually from 1961 to 1973 and biannually since 1973." -- p. xiii.
Note (Bibliography): Includes bibliographical references and author index.
Holding library: 国立国会図書館
Call No.: M17-13-2938
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 024457357
http://id.ndl.go.jp/bib/024457357
Cataloging Rule: Anglo-American Cataloging Rules
Bibliographic Record Category (NDL): 215