Board-level interconnection reliability of lead-free area array packages with various reworkable polymeric reinforcement materials

• Material Type: 博士論文
• Title: Board-level interconnection reliability of lead-free area array packages with various reworkable polymeric reinforcement materials
• Author/Editor: Hongbin Shi [著]
• Author Heading: 史, 洪賓 シ, コウヒン
• Publication, Distribution, etc.: [Hongbin Shi]
• Publication Date: [2013]
• Publication Date (W3CDTF): 2013
• Extent: 1冊
• Degree grantor/type: 早稲田大学
• Date Granted: 平成25年3月15日
• Date Granted (W3CDTF): 2013
• Dissertation Number: 甲第3794号
• Degree Type: 博士(工学)
• Note (Dissertation): 博士論文
• Place of Publication (Country Code): JP
• Text Language Code: eng
• NDLC: UT51
• Target Audience: 一般
• Note (General): 博士論文
• Holding library: 国立国会図書館
• Call No.: UT51-2013-D429
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 024801797; http://id.ndl.go.jp/bib/024801797
• Bibliographic Record Category (NDL): 213