電子資料

International Symposium on Interfacial Joining and Surface Technology solid state joining, brazing and soldering, surface treatment, advanced packaging : IJST 2013

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International Symposium on Interfacial Joining and Surface Technology solid state joining, brazing and soldering, surface treatment, advanced packaging : IJST 2013

Call No. (NDL)
YH245-B1196
Bibliographic ID of National Diet Library
025120680
Material type
電子資料
Author
溶接学会
Publisher
Technical Commission on Interfacial Joining, Japan Welding Society
Publication date
[2013]
Material Format
Recording Media
Capacity, size, etc.
CD-ROM 1枚 ; 12cm
NDC
-
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Notes on use

Note (General)：

会期・会場: 2013年11月27日-29日 Icho Kaikan, Osaka University, Japan共同刊行: Joining and Welding Research Institute, Osaka Universityほか

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Recording Media

Material Type
電子資料
Title
International Symposium on Interfacial Joining and Surface Technology solid state joining, brazing and soldering, surface treatment, advanced packaging : IJST 2013
Title Transcription
International Symposium on Interfacial Joining and Surface Technology solid state joining, brazing and soldering, surface treatment, advanced packaging : IJST 2013
Author Heading
溶接学会 ヨウセツ ガッカイ ( 00268454 )Authorities
Publication, Distribution, etc.
[東京] : Technical Commission on Interfacial Joining, Japan Welding Society
Publication Date
[2013]
Publication Date (W3CDTF)
2013
Extent
CD-ROM 1枚
Size
12cm
Place of Publication (Country Code)
JP