2014 4th IEEE international workshop on low temperature bonding for 3D integration : (LTB-3D 2014) : Tokyo, Japan : 15-16 July 2014 : LTB-3D conference : Jul 2014, Tokyo, Japan.

• Material Type: 図書
• ISBN: 9781479952625
• Title: 2014 4th IEEE international workshop on low temperature bonding for 3D integration : (LTB-3D 2014) : Tokyo, Japan : 15-16 July 2014 : LTB-3D conference : Jul 2014, Tokyo, Japan.
• Author Heading: IEEE International Workshop on Low Temperature Bonding for 3D Integration (4th : 2014 : Tokyo, Japan); Suga, Tadatomo, 1953-; Takagi, Hideki.; Higurashi, Eiji.
• Publication, Distribution, etc.: Piscataway, NJ : IEEE (出版)
• Publication Date: [2014]; 著作権日付 : ©2014
• Publication Date (W3CDTF): 2014
• Extent: 63 pages
• Other physical details: illustrations
• Size: 27 cm
• Place of Publication (Country Code): US
• Text Language Code: eng
• Content Type: text
• Media Type: unmediated
• Carrier Type: volume
• Subject Heading: Sealing (Technology)--Congresses.; Three-dimensional integrated circuits--Congresses.; Photonics--Materials--Congresses.
• NDLC: M17
• Target Audience: 一般
• Note (General): Papers.; IEEE catalog number CFP1418S-POD.
• Note (Bibliography): Includes bibliographical references.
• Holding library: 国立国会図書館
• Call No.: M17-15-2107
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 026336037; http://id.ndl.go.jp/bib/026336037
• Cataloging Rule: RDA
• Bibliographic Record Category (NDL): 215