図書

次世代パワー半導体実装の要素技術と信頼性 (エレクトロニクスシリーズ)

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次世代パワー半導体実装の要素技術と信頼性 = System Integration of Wide Band Gap Semiconductors

(エレクトロニクスシリーズ)

Call No. (NDL)
ND371-L86
Bibliographic ID of National Diet Library
027324367
Material type
図書
Author
菅沼克昭 監修
Publisher
シーエムシー出版
Publication date
2016.5
Material Format
Paper
Capacity, size, etc.
278p ; 26cm
NDC
549.8
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Table of Contents

  • 目次

  • 第1章 次世代パワー半導体の開発動向とモジュール化技術動向

  • 1 次世代パワー半導体の開発動向/ 1

    菅沼克昭

  • 1.1 次世代パワー半導体の魅力/ 1

  • 1.2 パワー半導体の実装と信頼性課題/ 6

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Paper

Material Type
図書
ISBN
978-4-7813-1161-6
Title
次世代パワー半導体実装の要素技術と信頼性
Title Transcription
ジセダイ パワー ハンドウタイ ジッソウ ノ ヨウソ ギジュツ ト シンライセイ
Author/Editor
菅沼克昭 監修
Series Title
エレクトロニクスシリーズ
Author Heading
菅沼, 克昭, 1955- スガヌマ, カツアキ, 1955- ( 00851045 )Authorities
Publication, Distribution, etc.
東京 : シーエムシー出版
Publication Date
2016.5
Publication Date (W3CDTF)
2016