2016 11th international microsystems, packaging, assembly and circuits technology conference : (IMPACT 2016) : Taipei, Taiwan : 26-28 October 2016 : IMPACT--IAAC 2016 : IMPACT-IAAC 2016 joint conference : IMPACT2016 : Oct 2016, Taipei, Taiwan.

2016 11th international microsystems, packaging, assembly and circuits technology conference : (IMPACT 2016) : Taipei, Taiwan : 26-28 October 2016 : IMPACT--IAAC 2016 : IMPACT-IAAC 2016 joint conference : IMPACT2016 : Oct 2016, Taipei, Taiwan.

Call No. (NDL): M17-18-960
Bibliographic ID of National Diet Library: 028361488

Material type: 図書

Author: International Microsystems, Packaging, Assembly, and Circuits Technology Conference (11th : 2016 : Taipei, Taiwan)ほか

Publisher: IEEE

Publication date: [2016]

Material Format: Paper

Capacity, size, etc.: 434 pages ; 28 cm

NDC: -

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Notes on use

Note (General)：: Program and papers."... IMPACT-IAAC 2016 Joint Conference which would be held in conjunction with TPCA Show 2016 ..."--Page 3."IMPACT 2016 will also b...

Other physical details：: illustrations

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Paper

Material Type: 図書
ISBN: 9781509047703 (Print-On-Demand)
ISSN: 2150-5934
Title: 2016 11th international microsystems, packaging, assembly and circuits technology conference : (IMPACT 2016) : Taipei, Taiwan : 26-28 October 2016 : IMPACT--IAAC 2016 : IMPACT-IAAC 2016 joint conference : IMPACT2016 : Oct 2016, Taipei, Taiwan.
Author Heading: International Microsystems, Packaging, Assembly, and Circuits Technology Conference (11th : 2016 : Taipei, Taiwan)
Components, Packaging & Manufacturing Technology Society. Taipei Chapter.
IMAPS All Asia Conference (2016 : Taipei, Taiwan)
Publication, Distribution, etc.: Piscataway, NJ : IEEE (出版)
Publication Date: [2016]
Publication Date (W3CDTF): 2016
Extent: 434 pages
Other physical details: illustrations
Size: 28 cm
Place of Publication (Country Code): US
Text Language Code: eng
Genre/Form Terms: Conference papers and proceedings.
Content Type: text
Media Type: unmediated
Carrier Type: volume
Subject Heading: Microelectromechanical systems--Congresses.
Microelectronic packaging--Congresses.
Microelectromechanical systems.
Microelectronic packaging.
LCC: TK7870.15
NDLC: M17
Target Audience: 一般
Note (General): Program and papers.
"... IMPACT-IAAC 2016 Joint Conference which would be held in conjunction with TPCA Show 2016 ..."--Page 3.
"IMPACT 2016 will also be held in conjunction with The IMAPS All Asia Conference, (IAAC 2016), ..."--Page 7.
IEEE catalog number CFP1659B-POD.
Note (Bibliography): Includes bibliographical references.
Holding library: 国立国会図書館
Call No.: M17-18-960
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 028361488
http://id.ndl.go.jp/bib/028361488
Cataloging Rule: RDA
Bibliographic Record Category (NDL): 215