3D integration in VLSI circuits : implementation technologies and applications

• Material Type: 図書
• ISBN: 9781138710399 (hardback : acidfree paper)
• ISBN (error code): 9781315200699 (ebook)
• Title: 3D integration in VLSI circuits : implementation technologies and applications
• Author/Editor: edited by Katsuyuki Sakuma; managing editor Krzysztof Iniewski.
• Series Title: Devices, circuits, and systems
• Author Heading: Sakuma, Katsuyuki. [佐久間克幸]; Iniewski, Krzysztof, 1960-
• Publication, Distribution, etc.: Boca Raton : CRC Press/Taylor & Francis Group (出版)
• Publication Date: [2018]
• Publication Date (W3CDTF): 2018
• Extent: xvi, 217 pages
• Size: 24 cm.
• Place of Publication (Country Code): US
• Text Language Code: eng
• Content Type: text
• Media Type: unmediated
• Carrier Type: volume
• Subject Heading: Three-dimensional integrated circuits.; Integrated circuits--Very large scale integration.
• LCC: TK7874.893
• DDC: 621.39/5
• NDLC: ND386
• Target Audience: 一般
• Note (Bibliography): Includes bibliographical references and index.
• Collection (particular): 日本関係外国語図書
• Holding library: 国立国会図書館
• Call No.: ND386-B40
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 028493365; http://id.ndl.go.jp/bib/028493365
• LC Control Number: 2018010530; https://lccn.loc.gov/2018010530
• Cataloging Rule: RDA
• Bibliographic Record Category (NDL): 211

• Contents: 3D Integration: Technology and Design / P. Franzon3D SiP for ASIC and 3D DRAM Integration / L. LiA New Class of High-capacity, Resource-rich FPGAs Ena...
• Summary, etc.: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integrati...