Wide bandgap power semiconductor packaging : materials, components, and reliability

• Material Type: 図書
• ISBN: 9780081020944 paperback; 0081020945 paperback
• ISBN (error code): 9780081020951 (ePub ebook)
• Title: Wide bandgap power semiconductor packaging : materials, components, and reliability
• Author/Editor: edited by Katsuaki Suganuma.
• Series Title: Woodhead Publishing series in electronic and optical materials
• Title Heading: Woodhead Publishing series in electronic and optical materials.
• Author Heading: 菅沼, 克昭, 1955- スガヌマ, カツアキ, 1955- ( 00851045 )Authorities
• Publication, Distribution, etc.: Duxford, United Kingdom : Woodhead Publishing, an imprint of Elsevier (出版); Cambridge, MA : Woodhead Publishing, an imprint of Elsevier (出版)
• Publication Date: [2018]
• Publication Date (W3CDTF): 2018
• Extent: x, 229 pages
• Size: 23 cm.
• Place of Publication (Country Code): GB
• Text Language Code: eng
• Content Type: text
• Media Type: unmediated
• Carrier Type: volume
• Subject Heading: Wide gap semiconductors.; Microelectronic packaging.
• LCC: TK7871.85
• DDC: 621.3815/2
• NDLC: ND371
• Target Audience: 一般
• Note (Bibliography): Includes bibliographical references and index.
• Collection (particular): 日本関係外国語図書
• Holding library: 国立国会図書館
• Call No.: ND371-B123
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 029285266; http://id.ndl.go.jp/bib/029285266
• OCLC No.: 1011515104; https://www.worldcat.org/oclc/1011515104
• Cataloging Rule: RDA
• Bibliographic Record Category (NDL): 211

• Contents: Machine generated contents note: pt. One Future prospects1. Future technology trends / Oliver Hilt1.1. Power electronics system development trend...
• Summary, etc.: "Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face du...