TEI'18 : proceedings of the twelfth international conference on tangible, embedded, and embodied interaction : March 18-21, 2018 : Stockholm, Sweden : ACM TEI'18 : 12th international conference on tangible, embedded and embodied interactions : TEI conference : Mar 2018, Stockholm, Sweden.

TEI'18 : proceedings of the twelfth international conference on tangible, embedded, and embodied interaction : March 18-21, 2018 : Stockholm, Sweden : ACM TEI'18 : 12th international conference on tangible, embedded and embodied interactions : TEI conference : Mar 2018, Stockholm, Sweden.

Call No. (NDL): M17-20-268
Bibliographic ID of National Diet Library: 029440563

Material type: 図書

Author: International Conference on Tangible, Embedded and Embodied Interaction (12th : 2018 : Stockholm, Sweden)

Publisher: The Association for Computing Machinery

Publication date: [2018]

Material Format: Paper

Capacity, size, etc.: xv, 750 pages ; 28 cm

NDC: -

View All

Notes on use

Note (General)：: Papers."TEI'18 hosts a four-day program, starting on Sunday March 18th with the Graduate Student Consortium ..."--Page iii.

Other physical details：: illustrations

Search by Bookstore

Bibliographic Record

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Paper

Material Type: 図書
ISBN: 9781450358781 (Print)
Title: TEI'18 : proceedings of the twelfth international conference on tangible, embedded, and embodied interaction : March 18-21, 2018 : Stockholm, Sweden : ACM TEI'18 : 12th international conference on tangible, embedded and embodied interactions : TEI conference : Mar 2018, Stockholm, Sweden.
Author Heading: International Conference on Tangible, Embedded and Embodied Interaction (12th : 2018 : Stockholm, Sweden)
Publication, Distribution, etc.: New York, New York : The Association for Computing Machinery (出版)
Publication Date (W3CDTF): 2018
Extent: xv, 750 pages
Other physical details: illustrations
Size: 28 cm
Alternative Title: TEI'18 : proceedings of the 12th international conference on tangible, embedded, and embodied interaction : March 18-21, 2018 : Stockholm, Sweden
Place of Publication (Country Code): US
Text Language Code: eng
Genre/Form Terms: Conference papers and proceedings.
Content Type: text
Media Type: unmediated
Carrier Type: volume
Subject Heading: Virtual reality--Congresses.
Embedded computer systems--Congresses.
User interfaces (Computer systems)--Congresses.
Interactive computer systems--Congresses.
Embedded computer systems.
Interactive computer systems.
User interfaces (Computer systems)
Virtual reality.
LCC: QA76.9.U83
NDLC: M17
Target Audience: 一般
Note (General): Papers.
"TEI'18 hosts a four-day program, starting on Sunday March 18th with the Graduate Student Consortium ..."--Page iii.
Note (Bibliography): Includes bibliographical references and author index.
Holding library: 国立国会図書館
Call No.: M17-20-268
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 029440563
http://id.ndl.go.jp/bib/029440563
Cataloging Rule: RDA
Bibliographic Record Category (NDL): 215