Semiconductors: silicon carbide and related materials : Asia-Pacific conference on silicon carbide and related materials : (APCSCRM 2018) : selected, peer reviewed papers from the Asia-Pacific conference on silicon carbide and related materials (APCSCRM 2018), July 9-12, 2018, Beijing, China : APCSCRM2018 : Jul 2018, Beijing, China. (Materials Science Forum ; 954)

Semiconductors: silicon carbide and related materials : Asia-Pacific conference on silicon carbide and related materials : (APCSCRM 2018) : selected, peer reviewed papers from the Asia-Pacific conference on silicon carbide and related materials (APCSCRM 2018), July 9-12, 2018, Beijing, China : APCSCRM2018 : Jul 2018, Beijing, China.

(Materials Science Forum ; 954)

Call No. (NDL): M17-20-690
Bibliographic ID of National Diet Library: 029787802

Material type: 図書

Author: Asia-Pacific Conference on Silicon Carbide and Related Materials (2018 : Beijing, China)ほか

Publisher: Trans Tech Publications Ltd

Publication date: [2019]

Material Format: Paper

Capacity, size, etc.: xi, 214 pages ; 25 cm.

NDC: -

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Notes on use

Note (General)：: Selected papers."And the first conference (APCSCRM2018) has been held on July 9-12, 2018 ..."--Preface.

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Paper

Material Type: 図書
ISBN: 9783035713855
ISSN (series): 0255-5476
Title: Semiconductors: silicon carbide and related materials : Asia-Pacific conference on silicon carbide and related materials : (APCSCRM 2018) : selected, peer reviewed papers from the Asia-Pacific conference on silicon carbide and related materials (APCSCRM 2018), July 9-12, 2018, Beijing, China : APCSCRM2018 : Jul 2018, Beijing, China.
Series Title: Materials Science Forum ; 954
Title Heading: Materials science forum ; v. 954.
Author Heading: Asia-Pacific Conference on Silicon Carbide and Related Materials (2018 : Beijing, China)
Lu, Min.
Publication, Distribution, etc.: Zurich, Switzerland : Trans Tech Publications Ltd (出版)
Publication Date: [2019]
Publication Date (W3CDTF): 2019
Extent: xi, 214 pages
Size: 25 cm.
Alternative Title: AP SiC : APCSCRM 2018
Place of Publication (Country Code): CH
Text Language Code: eng
Genre/Form Terms: Conference papers and proceedings.
Content Type: text
Media Type: unmediated
Carrier Type: volume
Subject Heading: Semiconductors--Congresses.
TECHNOLOGY & ENGINEERING / Mechanical.
Semiconductors.
LCC: TK7871.85
DDC: 621.38152
NDLC: M17
Target Audience: 一般
Note (General): Selected papers.
"And the first conference (APCSCRM2018) has been held on July 9-12, 2018 ..."--Preface.
Note (Bibliography): Includes bibliographical references and indexes.
Holding library: 国立国会図書館
Call No.: M17-20-690
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 029787802
http://id.ndl.go.jp/bib/029787802
Cataloging Rule: RDA
Bibliographic Record Category (NDL): 215