Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2018-- : presented at ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 27-30, 2018 : San Francisco, California, USA : InterPACK : robotics, maker, and additively manufactured heat sink workshops : InterPACK2018 : Aug 2018, San Francisco, CA.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2018-- : presented at ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 27-30, 2018 : San Francisco, California, USA : InterPACK : robotics, maker, and additively manufactured heat sink workshops : InterPACK2018 : Aug 2018, San Francisco, CA.

Call No. (NDL): M17-20-1069
Bibliographic ID of National Diet Library: 030095061

Material type: 図書

Author: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.)

Publisher: The American Society of Mechanical Engineers

Publication date: [2019]

Material Format: Paper

Capacity, size, etc.: 1 volume (various pagings) ; 28 cm

NDC: -

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Notes on use

Note (General)：: Papers."The organizers have developed a comprehensive technical program, with nearly 185 technical papers and presentations, as well as posters, tutor...

Other physical details：: illustrations (black and white)

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Paper

Material Type: 図書
ISBN: 9780791851920 paperback
Title: Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2018-- : presented at ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 27-30, 2018 : San Francisco, California, USA : InterPACK : robotics, maker, and additively manufactured heat sink workshops : InterPACK2018 : Aug 2018, San Francisco, CA.
Author Heading: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.)
Publication, Distribution, etc.: New York, N.Y. : The American Society of Mechanical Engineers (出版)
Publication Date: [2019]
Publication Date (W3CDTF): 2019
Extent: 1 volume (various pagings)
Other physical details: illustrations (black and white)
Size: 28 cm
Alternative Title: 2018 proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : IPACK2018
Place of Publication (Country Code): US
Text Language Code: eng
Genre/Form Terms: Conference papers and proceedings.
Content Type: text
Media Type: unmediated
Carrier Type: volume
Subject Heading: Electronic packaging--Congresses.
Electronic packaging.
IPACK2018
DDC: 621.381046
NDLC: M17
Target Audience: 一般
Note (General): Papers.
"The organizers have developed a comprehensive technical program, with nearly 185 technical papers and presentations, as well as posters, tutorials, panels, workshops, and ..."--Page iii.
Note (Bibliography): Includes bibliographical references and author index.
Note (Additional Physical Form Available): Also published electronically.
Holding library: 国立国会図書館
Call No.: M17-20-1069
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 030095061
http://id.ndl.go.jp/bib/030095061
OCLC No.: 1125067753
https://www.worldcat.org/oclc/1125067753
Cataloging Rule: RDA
Bibliographic Record Category (NDL): 215