Materials and processes for semiconductor, 2.5 and 3D chip packaging and high density interconnection PCB 2 : international symposium on materials and processes for semiconductor, 2.5 and 3D chip packaging, and high density interconnection PCB 2 : 236th meeting of the Electrochemical Society : Oct 2019, Atlanta, GA. (ECS Transactions ; 92 (no. 5))

Materials and processes for semiconductor, 2.5 and 3D chip packaging and high density interconnection PCB 2 : international symposium on materials and processes for semiconductor, 2.5 and 3D chip packaging, and high density interconnection PCB 2 : 236th meeting of the Electrochemical Society : Oct 2019, Atlanta, GA.

(ECS Transactions ; 92 (no. 5))

Call No. (NDL): M17-20-1136
Bibliographic ID of National Diet Library: 030181583

Material type: 図書

Author: -

Publisher: The Electrochemical Society

Publication date: [2019]

Material Format: Paper

Capacity, size, etc.: v, 47 pages ; 24 cm.

NDC: -

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Notes on use

Note (General)：: Papers."Once more, the topics of this annual symposium focused upon ..."--Preface.

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Paper

Material Type: 図書
ISBN: 9781510895911
ISSN (series): 1938-5862
Title: Materials and processes for semiconductor, 2.5 and 3D chip packaging and high density interconnection PCB 2 : international symposium on materials and processes for semiconductor, 2.5 and 3D chip packaging, and high density interconnection PCB 2 : 236th meeting of the Electrochemical Society : Oct 2019, Atlanta, GA.
Series Title: ECS Transactions ; 92 (no. 5)
Publication, Distribution, etc.: Pennington, NJ, USA : The Electrochemical Society (出版)
Publication Date: [2019]
Publication Date (W3CDTF): 2019
Extent: v, 47 pages
Size: 24 cm.
Alternative Title: Electronic materials and processing
Place of Publication (Country Code): US
Text Language Code: eng
Content Type: text
Media Type: unmediated
Carrier Type: volume
NDLC: M17
Target Audience: 一般
Note (General): Papers.
"Once more, the topics of this annual symposium focused upon ..."--Preface.
Note (Bibliography): Includes bibliographical references and author index.
Holding library: 国立国会図書館
Call No.: M17-20-1136
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 030181583
http://id.ndl.go.jp/bib/030181583
Cataloging Rule: RDA
Bibliographic Record Category (NDL): 215