Proceedings of the ASME international technical conference on packaging and integration of electronic and photonic microsystems--2020-- : presented at ASME 2020 international technical conference on packaging and integration of electronic and photonic microsystems : October 27-29, 2020 : online : ASME 2020 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : Oct 2020, ------.

Proceedings of the ASME international technical conference on packaging and integration of electronic and photonic microsystems--2020-- : presented at ASME 2020 international technical conference on packaging and integration of electronic and photonic microsystems : October 27-29, 2020 : online : ASME 2020 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : Oct 2020, ------.

Call No. (NDL): M17-21-768
Bibliographic ID of National Diet Library: 031304768

Material type: 図書

Author: -

Publisher: The American Society of Mechanical Engineers (ASME)

Publication date: [2020]

Material Format: Paper

Capacity, size, etc.: 1 volume (various pagings) ; 28 cm

NDC: -

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Notes on use

Note (General)：: Papers.

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Paper

Material Type: 図書
ISBN: 9780791884041
Title: Proceedings of the ASME international technical conference on packaging and integration of electronic and photonic microsystems--2020-- : presented at ASME 2020 international technical conference on packaging and integration of electronic and photonic microsystems : October 27-29, 2020 : online : ASME 2020 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : Oct 2020, ------.
Publication, Distribution, etc.: New York, NY : The American Society of Mechanical Engineers (ASME) (出版)
Publication Date: [2020]
Publication Date (W3CDTF): 2020
Extent: 1 volume (various pagings)
Size: 28 cm
Alternative Title: 2020 proceedings of the ASME international technical conference on packaging and integration of electronic and photonic microsystems : InterPACK2020
Place of Publication (Country Code): US
Text Language Code: eng
Content Type: text
Media Type: unmediated
Carrier Type: volume
NDLC: M17
Target Audience: 一般
Note (General): Papers.
Note (Bibliography): Includes bibliographical references and author index.
Holding library: 国立国会図書館
Call No.: M17-21-768
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 031304768
http://id.ndl.go.jp/bib/031304768
Cataloging Rule: RDA
Bibliographic Record Category (NDL): 215