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図書

1996 International Conference on Simulation of Semiconductor Processes and Devices : SISPAD '96, September 2-4, 1996, Toyo University, Hakusan Campus, Tokyo, Japan :softbound

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1996 International Conference on Simulation of Semiconductor Processes and Devices : SISPAD '96, September 2-4, 1996, Toyo University, Hakusan Campus, Tokyo, Japan :softbound

Material type
図書
Author
sponsored by Japan Society of Applied Physics, IEEE Electron Devices Society ; in cooperation with Institute of Electronics, Communication and Information Engineers, IEEE Electron Devices Tokyo Chapter
Publisher
Business Center for Academic Societies
Publication date
c1996
Material Format
Paper
Capacity, size, etc.
25 cm
NDC
-
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Notes on use

Note (General):

"IEEE catalog number 96TH8095"--T.p. versoIncludes bibliographical references and index

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Paper

Material Type
図書
ISBN
0780327454
Volume
:softbound
Author/Editor
sponsored by Japan Society of Applied Physics, IEEE Electron Devices Society ; in cooperation with Institute of Electronics, Communication and Information Engineers, IEEE Electron Devices Tokyo Chapter
Publication Date
c1996
Publication Date (W3CDTF)
1996
Size
25 cm