図書

23rd Symposium on "Microjoining and Assembly Technology in Electronics", January 31 - February 1, 2017, Yokohama

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23rd Symposium on "Microjoining and Assembly Technology in Electronics", January 31 - February 1, 2017, Yokohama

Material type
図書
Author
Symposium on Microjoining and Assembly Technology in Electronicsほか
Publisher
溶接学会
Publication date
2017.1
Material Format
Paper
Capacity, size, etc.
30cm
NDC
-
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Notes on use

Note (General):

Sponsored by Committee on Manufacturing Science and Technology in Electronics (SPS), Microjoining Commission (JWS)参考文献あり抄録は英語

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Paper

Material Type
図書
Publication, Distribution, etc.
Publication Date
2017.1
Publication Date (W3CDTF)
2017
Size
30cm
Alternative Title
Mate 2017
第23回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol.23, 2017
Proceedings of the 23rd Symposium on Microjoining and Assembly Technology in Electronics, Vol.23, 2017
Place of Publication (Country Code)
ja
Target Audience
一般