Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California

Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California

Material type: 図書

Author: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Sheng Liu, Zhengfang Qian, Chao-pin Yeh

Publisher: American Society of Mechanical Engineers

Publication date: c1998

Material Format: Paper

Capacity, size, etc.: 28 cm

NDC: -

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Note (General)：: "Papers presented at the annual ASME Symposium on Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures"--ForewordIncludes...

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Paper

Material Type: 図書
ISBN: 0791815919
Title: Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California
Author/Editor: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Sheng Liu, Zhengfang Qian, Chao-pin Yeh
Author Heading: Liu, S. (Sheng)
Qian, Zhengfang
Yeh, Chao-pin
American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
https://ci.nii.ac.jp/author/DA07130252
International Mechanical Engineering Congress and Exposition
https://ci.nii.ac.jp/author/DA09785194
ASME Symposium on Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures (1998 : Anaheim, Calif.)
Publication, Distribution, etc.: American Society of Mechanical Engineers
Publication Date: c1998
Publication Date (W3CDTF): 1998
Size: 28 cm
Alternative Title: Characterization of evolving packaging materials and structures
Evolving packaging materials and structures
Packaging materials and structures
Place of Publication (Country Code): us
Text Language Code: en
Subject Heading: Electronic packaging -- Testing Congresses
Electronic packaging -- Materials -- Fatigue Congresses
Thermal stresses Congresses
Deformation (Mechanics) Congresses
LCC: TK7870.15
Target Audience: 一般
Note (General): "Papers presented at the annual ASME Symposium on Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures"--Foreword
Includes bibliographical references and author index
Related Material: EEP
https://cir.nii.ac.jp/crid/1130000795098904960
Related Material (URI): https://ci.nii.ac.jp/ncid/BA44132647#entity
https://lccn.loc.gov/98074430
Periodical Title: EEP
https://cir.nii.ac.jp/crid/1130000795098904960
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BA44132647 : BA44132647
LC Control Number: 98074430
https://lccn.loc.gov/98074430