Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly : pbk.

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Material Type: 図書
ISBN: 0442013531
Title: Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly
Volume: : pbk.
Author/Editor: Jennie S. Hwang
Author Heading: Hwang, Jennie S.
https://ci.nii.ac.jp/author/DA03953591
Publication, Distribution, etc.: Van Nostrand Reinhold
Publication Date: c1992
Publication Date (W3CDTF): 1992
Size: 23 cm
Place of Publication (Country Code): us
Text Language Code: en
Subject Heading: Printed circuits -- Design and construction
Solder pastes
Surface mount technology
LCC: TK7868.P7
Target Audience: 一般
Note (General): Includes bibliographies and index
Related Material (URI): https://ci.nii.ac.jp/ncid/BA18884259#entity
https://lccn.loc.gov/88028015
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BA18884259 : BA18884259
LC Control Number: 88028015
https://lccn.loc.gov/88028015