部品とサブシステム第6版

部品とサブシステム

第6版

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Material Type: 図書
ISBN: 9784274506192
Title: 部品とサブシステム
Title Transcription: ブヒントサブシステム
Author/Editor: Ivan P. Kaminow, Tingye Li, Alan E. Willner共編 ; 木村達也訳
Edition: 第6版
Author Heading: Kaminow, Ivan P.
https://ci.nii.ac.jp/author/DA03045399
Li, Tingye
https://ci.nii.ac.jp/author/DA00298161
Willner, Alan E.
https://ci.nii.ac.jp/author/DA10452450
木村, 達也キムラ, タツヤ
https://ci.nii.ac.jp/author/DA00662854
Publication, Distribution, etc.: オーム社
Publication Date: 2016.8
Publication Date (W3CDTF): 2016
Size: 21cm
Alternative Title: Components and subsystems
Place of Publication (Country Code): ja
Text Language Code: ja
Subject Heading: 光通信
光ファイバー
NDC 8th ed.: 547.68
NDC 9th ed.: 547.68 : Communication engineering
Target Audience: 一般
Note (General): 参考文献: 章末
Related Material: 光ファイバ通信 : 部品・システムからネットワークへ
https://cir.nii.ac.jp/crid/1130000794389531392
Related Material (URI): https://ci.nii.ac.jp/ncid/BB21971100#entity
Periodical Title: 光ファイバ通信 : 部品・システムからネットワークへ
https://cir.nii.ac.jp/crid/1130000794389531392
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BB21971100 : BB21971100