10th Symposium on "Microjoining and Assembly Technology in Electronics", February 5-6 2004, Yokohama

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Note (General)：: Sponsored by Microjoining Commission (JWS), Society of Manufacturing Science for Electronics (under preparation)参考文献あり

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Material Type: 図書
ISBN: 4906110452
Title: 10th Symposium on "Microjoining and Assembly Technology in Electronics", February 5-6 2004, Yokohama
Author Heading: Symposium on Microjoining and Assembly Technology in Electronics
溶接学会ヨウセツガッカイ
https://ci.nii.ac.jp/author/DA00606627
Publication, Distribution, etc.: 溶接学会
Publication Date: 2004.2
Publication Date (W3CDTF): 2004
Size: 30cm
Alternative Title: Mate 2004
第10回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol.10, 2004
Proceedings of the 10th Symposium on Microjoining and Assembly Technology in Electronics, vol.10, 2004
Place of Publication (Country Code): ja
Target Audience: 一般
Note (General): Sponsored by Microjoining Commission (JWS), Society of Manufacturing Science for Electronics (under preparation)
参考文献あり
Related Material (URI): https://ci.nii.ac.jp/ncid/BB0696674X#entity
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BB0696674X : BB0696674X