図書

Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium

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Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium

Material type
図書
Author
editor, G.S. Mathad ; assistant editors, B.C. Baker ... [et al.] ; sponsoring divisions, Dielectric Science and Technology, Electronics, Electrodeposition
Publisher
Electrochemical Society
Publication date
c2003
Material Format
Paper
Capacity, size, etc.
24 cm
NDC
-
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"... was held as part of the 202nd Meeting of the Electrochemical Society, Inc., in Salt Lake City, UT, October 20-24, 2002"--on prefIncludes bibliogr...

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Paper

Material Type
図書
ISBN
1566773792
Author/Editor
editor, G.S. Mathad ; assistant editors, B.C. Baker ... [et al.] ; sponsoring divisions, Dielectric Science and Technology, Electronics, Electrodeposition
Publication, Distribution, etc.
Publication Date
c2003
Publication Date (W3CDTF)
2003
Size
24 cm
Place of Publication (Country Code)
us