18th Symposium on "Microjoining and Assembly Technology in Electronics", January 31 - February 1 2012, Yokohama

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Material Type: 図書
ISBN: 9784906110193
Title: 18th Symposium on "Microjoining and Assembly Technology in Electronics", January 31 - February 1 2012, Yokohama
Author Heading: Symposium on Microjoining and Assembly Technology in Electronics
溶接学会ヨウセツガッカイ
https://ci.nii.ac.jp/author/DA00606627
Publication, Distribution, etc.: 溶接学会
Publication Date: 2012.1
Publication Date (W3CDTF): 2012
Size: 30cm
Alternative Title: Mate 2012
第18回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol.18, 2012
Proceedings of the 18th Symposium on Microjoining and Assembly Technology in Electronics, vol.18, 2012
Place of Publication (Country Code): ja
Target Audience: 一般
Note (General): Sponsored by Microjoining Commission (JWS)
参考文献あり
Related Material (URI): https://ci.nii.ac.jp/ncid/BB09365597#entity
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BB09365597 : BB09365597