Microelectronics comes of age : symposium summaries : Presented at the 1967 Western Electronic Show and Convention by the IEEE Group on Parts, Materials, and Packaging, August 23 and 24, San Francisco

Microelectronics comes of age : symposium summaries : Presented at the 1967 Western Electronic Show and Convention by the IEEE Group on Parts, Materials, and Packaging, August 23 and 24, San Francisco

Material type: 図書

Author: Microelectronics Comes of Age Symposiumほか

Publisher: Western Electronic Show and Convention

Publication date: c1967

Material Format: Paper

Capacity, size, etc.: 28 cm

NDC: -

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Note (General)：: Title from coverIncludes bibliographies

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Paper

Material Type: 図書
Title: Microelectronics comes of age : symposium summaries : Presented at the 1967 Western Electronic Show and Convention by the IEEE Group on Parts, Materials, and Packaging, August 23 and 24, San Francisco
Author Heading: Microelectronics Comes of Age Symposium
Western Electronic Show and Convention
https://ci.nii.ac.jp/author/DA06035201
Institute of Electrical and Electronics Engineers. Parts, Material, and Packaging Group
Publication, Distribution, etc.: Western Electronic Show and Convention
Publication Date: c1967
Publication Date (W3CDTF): 1967
Size: 28 cm
Place of Publication (Country Code): us
Text Language Code: en
Subject Heading: Microelectronics
LCC: TK7874
Target Audience: 一般
Note (General): Title from cover
Includes bibliographies
Related Material (URI): https://ci.nii.ac.jp/ncid/BB07632014#entity
https://lccn.loc.gov/68003715
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BB07632014 : BB07632014
LC Control Number: 68003715
https://lccn.loc.gov/68003715